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1

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Aging effect on wettability of negative photoresist with fine-pitch micro-holes after O2 plasma treatment

Ren, Wen, Sun, Menglong, Ling, Huiqin, Hu, Anmin, Li, Ming, Zhang, Wenqi, Dai, Fengwei, Cao, Liqiang

Année:

2017

Langue:

english

Fichier:

PDF, 11.01 MB

english, 2017

2

Time series prediction for output of multi-region solar power plants

Zheng, Jianqin, Zhang, Haoran, Dai, Yuanhao, Wang, Bohong, Zheng, Taicheng, Liao, Qi, Liang, Yongtu, Zhang, Fengwei, Song, Xuan

Journal:

Année:

2020

Langue:

english

Fichier:

PDF, 3.23 MB

english, 2020

3

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - The development of low cost Through Glass Via (TGV) interposer using additive method for via filling

Sun, Yu, Yu, Daquan, He, Ran, Dai, Fengwei, Sun, Xiaofeng, Wan, Lixi

Année:

2012

Langue:

english

Fichier:

PDF, 2.83 MB

english, 2012

4

Low temperature wafer level conformal polymer dielectric spray coating for through silicon vias with 2:1 aspect ratio

Zhuang, Yuechen, Yu, Daquan, Dai, Fengwei, Niu, Zhongcai

Journal:

Microsystem Technologies

Année:

2016

Langue:

english

Fichier:

PDF, 586 KB

english, 2016

5

Designing li-protective layer via SOCl2 additive for stabilizing lithium-sulfur battery

Li, Sheng, Dai, Hongliu, Li, Yahui, Lai, Chao, Wang, Jiulin, Huo, Fengwei, Wang, Chao

Journal:

Energy Storage Materials

Année:

2018

Langue:

english

Fichier:

PDF, 1.51 MB

english, 2018

6

Study on the Effect of Iron-Based Deoxidizing Inhibitors for Coal Spontaneous Combustion Prevention

Hao, Chaoyu, Chen, Yanling, Wang, Jiren, Deng, Cunbao, Xu, Guang, Dai, Fengwei, Si, Rui, Wang, Hongfei, Wang, Haoyu

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 11.88 MB

english, 2018

7

Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application

Su, Meiying, Yu, Daquan, Liu, Yijun, Wan, Lixi, Song, Chongshen, Dai, Fengwei, Xue, Kai, Jing, Xiangmeng, Guidotti, Daniel

Journal:

Thin Solid Films

Année:

2014

Langue:

english

Fichier:

PDF, 478 KB

english, 2014

8

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Numerical simulation and experimental verification of copper plating with different additives for through silicon vias

Song, Chongshen, Wu, Heng, Jing, Xiangmeng, Dai, Fengwei, Yu, Daquan, Wan, Lixi

Année:

2012

Langue:

english

Fichier:

PDF, 2.84 MB

english, 2012

9

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Study on undercutting of electroplated micro-bumps with different etchants

Dai, Fengwei, Yu, Daquan, Yin, Wen, Jing, Xiangmeng, Wan, Lixi

Année:

2012

Langue:

english

Fichier:

PDF, 1.71 MB

english, 2012

10

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Effect of IMC growth on thermal cycling reliability of micro solder bumps

Liu, Haiyan, Xu, Cheng, Liu, Xiaoyang, Yu, Daquan, Dai, Fengwei, Lu, Yuan, Shangguan, Dongkai

Année:

2013

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2013

11

High frequency characterization and analysis of through silicon vias and coplanar waveguides for silicon interposer

Wang, Huijuan, Ren, Xiaoli, Zhou, Jing, Pang, Cheng, Song, Chongsheng, Dai, Fengwei, Xue, Kai, Jiang, Feng, Yu, Daquan, Wan, Lixi

Journal:

Microsystem Technologies

Année:

2016

Langue:

english

Fichier:

PDF, 3.02 MB

english, 2016

12

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - A study of high-density embedded capacitor for silicon-substrate package

Huijuan Wang,, Fengwei Dai,, Guidotti, Daniel, Yao Lv,, Liqiang Cao,, Lixi Wan,

Année:

2010

Langue:

english

Fichier:

PDF, 782 KB

english, 2010

13

Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3:1 aspect ratio

Xiao, Zhiyi, Yao, Mingjun, Yu, Daquan, Zhou, Minghao, Dai, Fengwei, Fan, Jun, Xiang, Min, Zhang, Wei

Journal:

Microsystem Technologies

Année:

2017

Langue:

english

Fichier:

PDF, 1.88 MB

english, 2017

14

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Process Development of Ultra-Fine Pitch High Density Micro Bumps

Yang, Dengfeng, Dai, Fengwei, Zhang, Wenqi, Wang, Guojun, Cao, Liqiang

Année:

2018

Langue:

english

Fichier:

PDF, 7.35 MB

english, 2018

15

Experimental study on metal chelating agent inhibiting spontaneous combustion of coal

Qiao, Ling, Deng, Cunbao, Dai, Fengwei, Fan, Yongpeng

Journal:

Année:

2019

Langue:

english

Fichier:

PDF, 324 KB

english, 2019

16

Experimental study on controlled-release inhibitor foam for restraining spontaneous combustion of coal

Zhang, Xun, Yang, Jing, Xie, Pengfei, Liu, Hao, Deng, Qiang, Dai, Fengwei

Journal:

Energy Exploration & Exploitation

Année:

2020

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2020

17

Targeted inertization with flue gas injection in fully mechanized caving gob for residual coal spontaneous combustion prevention with CFD modeling

Huang, Ge, Wang, Jiren, Dai, Fengwei, Deng, Cunbao

Journal:

Energy Science & Engineering

Année:

2020

Fichier:

PDF, 2.29 MB

2020

18

[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Defect control in epoxy dry film with improved electric performances

Luo, Suibin, Gao, Chunbo, Cao, Liqiang, Yu, Shuhui, Yu, Junyi, Dai, Fengwei, Sun, Rong, Wong, Ching-Ping

Année:

2020

Fichier:

PDF, 4.01 MB

2020

19

CO2 reforming of CH4 by combination of thermal plasma and catalyst

Xumei Tao, Fengwei Qi, Yongxiang Yin, Xiaoyan Dai

Journal:

International Journal of Hydrogen Energy

Année:

2008

Langue:

english

Fichier:

PDF, 240 KB

english, 2008

20

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Fabrication of PN junction capacitor using SiP technology on Si-based interposer wafer

Dai Fengwei,, Wang Huijuan,, Wang Qidong,, Zhou Jing,, Gao Wei,, Guo Xueping,, Cao Liqiang,, Wan Lixi,

Année:

2010

Langue:

english

Fichier:

PDF, 1.16 MB

english, 2010

21

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Accurate electrical simulation and design optimization for silicon interposer considering the MOS effect and eddy currents in the silicon substrate

Zhou, Jing, Wan, Lixi, Dai, Fengwei, Wang, Huijuan, Song, Chongshen, Du, Tianmin, Chu, Yanbiao, Pan, Maoyun, Guidotti, Daniel, Cao, Liqiang, Yu, Daquan

Année:

2012

Langue:

english

Fichier:

PDF, 2.04 MB

english, 2012

22

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Development of new TSV structure composing of intermetallic compounds

Daquan Yu,, Xiaoyang Liu,, Ran He,, Xiangmeng Jing,, Chongshen Song,, Fengwei Dai,, Yu Sun,, Lixi Wan,

Année:

2012

Langue:

english

Fichier:

PDF, 775 KB

english, 2012

23

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Study of Mixed-signal crosstalk in 3-D package

Shuhua Liu,, Liqiang Cao,, Jun Li,, Yunyan Zhou,, Jing Zhou,, Qidong Wang,, Fengwei Dai,, Lixi Wan,, Guidotti, Daniel

Année:

2010

Langue:

english

Fichier:

PDF, 846 KB

english, 2010

24

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump

Fengwei Dai,, Daquan Yu,, Wen Yin,, Ning Zhao,, Lixi Wan,, Han Yu,, Su Wang,, Jiangyan Sun,

Année:

2011

Langue:

english

Fichier:

PDF, 1.15 MB

english, 2011

25

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Characteristics of high frequency and high density through silicon vias (TSVs)

Wang Qidong,, Guo Xueping,, Wang Huijuan,, Dai Fengwei,, Zhou Jing,, Gao Wei,, Li Jun,, Cao Liqiang,, Wan Lixi,, Guidotti, Daniel

Année:

2010

Langue:

english

Fichier:

PDF, 872 KB

english, 2010

26

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Design of test structures for electrical and reliability measurements in a 2.5D TSV interposer

Wang, Huijuan, Zhou, Jing, Song, Chongshen, Yu, Daquan, Dai, Fengwei, Guidotti, Daniel, Song, Yang, Jie, Pan, Delong, Qiu, Huimin, He, Peng, Wu, Du, Tianmin, Cao, Liqiang, Wan, Lixi

Année:

2013

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2013

27

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Study of metal mask assisted TSV bottom the dielectric layer etching process

Dai, Fengwei, Niu, Zhongcai, Zhang, Wenqi

Année:

2014

Langue:

english

Fichier:

PDF, 930 KB

english, 2014

28

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Study of equivalent thermal modeling and simulation of 2.5D/3D stacked dies module

Dai, Fengwei, Yu, Daquan, Zhou, Jing, Ma, He, Wu, Xiaomeng, Jing, Xiangmeng, Song, Chongshen, He, Hongwen

Année:

2013

Langue:

english

Fichier:

PDF, 413 KB

english, 2013

29

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Investigation of silicon stress around through silicon vias by high efficiency micro-Raman microscopy

Xiangmeng, Jing, Daquan, Yu, Hongwen, He, Fengwei, Dai, Meiying, Su

Année:

2013

Langue:

english

Fichier:

PDF, 429 KB

english, 2013

30

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Mechanical and electronic analysis of 3D embedded capacitor filling with conductive adhesive

Wang, Huijuan, Yu, Daquan, He, Ran, Dai, Fengwei, Cao, Liqiang, Wan, Lixi

Année:

2011

Langue:

english

Fichier:

PDF, 1.96 MB

english, 2011

31

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Simulation analysis for interfacial failure of a poymer sealed MEMS device

Zhou, Jing, Wan, Lixi, Dai, Fengwei, Jing, Xiangmeng, Song, Chongshen, Guidotti, Daniel, Cao, Liqiang, Yu, Daquan

Année:

2012

Langue:

english

Fichier:

PDF, 1.46 MB

english, 2012

32

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging

Zhuang, Yuechen, Yu, Daquan, Dai, Fengwei, Zhang, Guoping, Fan, Jun

Année:

2014

Langue:

english

Fichier:

PDF, 539 KB

english, 2014

33

Three-dimensional PN junction capacitor for passive integration

Wang, Huijuan, Wan, Lixi, Yu, Daquan, Guidotti, Daniel, He, Ran, Dai, Fengwei, Cao, Liqiang, Zhang, Xia, Zhao, Ning, Guo, Xueping

Journal:

Applied Physics Letters

Année:

2011

Langue:

english

Fichier:

PDF, 919 KB

english, 2011

34

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Development of micro-alloying method for Cu pillar solder bump by solid liquid interaction

Yin, Wen, Yu, Daquan, Dai, Fengwei, Song, Chongshen, Bo, Zhang, Wan, Lixi, Yu, Han, Sun, Jiangyan

Année:

2012

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2012

35

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - The study of backside TSV reveal process by direct Si/Cu grinding and polishing

Xue, Kai, Yu, Daquan, Li, Yuesheng, Jiang, Feng, Liu, Haiyan, Wang, Qibing, Dai, Fengwei

Année:

2013

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2013

36

[IEEE 2013 IEEE 5th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE) - Chengdu, China (2013.10.29-2013.10.31)] 2013 5th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications - Design of wide-angle scanning parabolic torus reflector antenna realized by rotation of sub-reflector

Dai, Zuoxing, Shang, Yuanbo, Liu, Yuanyun, Xuan, Xiaobo, Zhang, Lidong, Yao, Fengwei

Année:

2013

Langue:

english

Fichier:

PDF, 197 KB

english, 2013

37

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Development and thermo-mechanical stress analysis of TSVs filling with Sn-based intermetallics

He, Ran, Song, Chongshen, Dai, Fengwei, Wang, Hong, Yu, Daquan

Année:

2012

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2012

38

[IEEE 2013 IEEE 5th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE) - Chengdu, China (2013.10.29-2013.10.31)] 2013 5th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications - A Ku band wide beam circular polarization antenna

Shang, Yuanbo, Dai, Zuoxing, Yao, Fengwei, Liu, Yuanyun, Xuan, Xiaobo

Année:

2013

Langue:

english

Fichier:

PDF, 206 KB

english, 2013

39

New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair

Zhou, Jing, Wan, Lixi, Li, Jun, Wang, Huijuan, Dai, Fengwei, Cao, Liqiang, Yu, Daquan, Guidotti, Daniel

Journal:

Journal of Semiconductors

Année:

2013

Langue:

english

Fichier:

PDF, 1.44 MB

english, 2013

40

High-speed through-silicon via filling method using Cu-cored solder balls

He, Ran, Wang, Huijuan, Yu, Daquan, Zhou, Jing, Dai, Fengwei, Song, Chongshen, Sun, Yu, Wan, Lixi

Journal:

Journal of Semiconductors

Année:

2012

Langue:

english

Fichier:

PDF, 112 KB

english, 2012

41

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Novel spray coating process with polymer material applied in CIS wafer-level-packaging

Zhuang, Yuechen, Yu, Daquan, Dai, Fengwei, Niu, Zhongcai, Zhang, Wenqi, Yong, Zhenzhong, Zhang, Guoping

Année:

2014

Langue:

english

Fichier:

PDF, 422 KB

english, 2014

42

A Paradoxical Role for Neutrophils in the Pathogenesis of West Nile Virus

Bai, Fengwei, Kong, Kok‐Fai, Dai, Jianfeng, Qian, Feng, Zhang, Lin, Brown, Charles R., Fikrig, Erol, Montgomery, Ruth R.

Journal:

The Journal of Infectious Diseases

Année:

2010

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2010

43

Efficient hydrolysis of corncob residue through cellulolytic enzymes from Trichoderma strain G26 and l-lactic acid preparation with the hydrolysate

Xie, Lulu, Zhao, Jin, Wu, Jian, Gao, Mingfu, Zhao, Zhewei, Lei, Xiangyun, Zhao, Yi, Yang, Wei, Gao, Xiaoxue, Ma, Cuiyun, Liu, Huanfei, Wu, Fengjuan, Wang, Xingxing, Zhang, Fengwei, Guo, Pengyuan, Dai,

Journal:

Bioresource Technology

Année:

2015

Langue:

english

Fichier:

PDF, 1.15 MB

english, 2015

44

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Investigation of temporary bonding and release processes for TSV with copper pillar bumps

Jing, Xiangmeng, Jiang, Feng, Xu, Cheng, Xue, Kai, Dai, Fengwei, Li, Zhaoqiang, Zhang, Wenqi

Année:

2014

Langue:

english

Fichier:

PDF, 464 KB

english, 2014

45

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Investigation of temporary bonding and release processes for TSV with copper pillar bumps

Jing, Xiangmeng, Jiang, Feng, Xu, Cheng, Xue, Kai, Dai, Fengwei, Li, Zhaoqiang, Zhang, Wenqi

Année:

2014

Langue:

english

Fichier:

PDF, 464 KB

english, 2014

46

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging

Zhuang, Yuechen, Yu, Daquan, Dai, Fengwei, Zhang, Guoping, Fan, Jun

Année:

2014

Langue:

english

Fichier:

PDF, 539 KB

english, 2014

47

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Study of metal mask assisted TSV bottom the dielectric layer etching process

Dai, Fengwei, Niu, Zhongcai, Zhang, Wenqi

Année:

2014

Langue:

english

Fichier:

PDF, 930 KB

english, 2014

48

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Via last TSV process for wafer level packaging

Jing, Xiangmeng, Dai, Fengwei, Zhang, Wenqi, Cao, Liqiang

Année:

2016

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2016

49

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Low Cost Wafer Level Packaging of MEMS Devices by Vertical Via-Last Process

Jing, Xiangmeng, Dai, Fengwei, Zhang, Chunyan, Zhang, Wenqi, Cao, Liqiang

Année:

2016

Langue:

english

Fichier:

PDF, 522 KB

english, 2016

50

Interleukin-17A Promotes CD8 + T Cell Cytotoxicity to Facilitate West Nile Virus Clearance

Acharya, Dhiraj, Wang, Penghua, Paul, Amber M., Dai, Jianfeng, Gate, David, Lowery, Jordan E., Stokic, Dobrivoje S., Leis, A. Arturo, Flavell, Richard A., Town, Terrence, Fikrig, Erol, Bai, Fengwei

Journal:

Journal of Virology

Année:

2016

Langue:

english

Fichier:

PDF, 1.50 MB

english, 2016